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Plating Process Product List and Ranking from 5 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Plating Process Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 奥野製薬工業 大阪・放出、東京、名古屋など Osaka//Chemical
  2. 柿原工業 Hiroshima//Automobiles and Transportation Equipment
  3. メルテックス Saitama//Manufacturing and processing contract
  4. 4 三協 本社工場 Osaka//Manufacturing and processing contract
  5. 5 ウチダ ウィンスター事業部 Osaka//Trading company/Wholesale
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Plating Process Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Electroless copper plating process for glass substrates for TGV surface treatment 奥野製薬工業 大阪・放出、東京、名古屋など
  2. Dry plating process "Chrome PVD" 柿原工業
  3. High connection reliability electroless copper plating process for semiconductor package substrates 奥野製薬工業 大阪・放出、東京、名古屋など
  4. 4 UBM formation plating process for aluminum electrodes on a wafer. 奥野製薬工業 大阪・放出、東京、名古屋など
  5. 4 Technological innovation to reduce transmission loss! Copper plating process on glass substrates. 奥野製薬工業 大阪・放出、東京、名古屋など

Plating Process Product List

1～15 item / All 19 items

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UBM formation plating process for aluminum electrodes on a wafer.

UBM formation plating process for aluminum electrodes on a wafer.

It is the process of forming UBM. It can improve the connection reliability between the aluminum electrode and the package terminal.

UBM stands for Under Bump Metal or Under Barrier Metal, and it is a film formed to join aluminum electrode pads on semiconductor chips with package terminals through wire bonding, soldering, or silver sintering. This film is composed of materials such as electroless nickel/gold plating or electroless nickel/palladium/gold plating. We offer a wide range of products that support the evolution of semiconductors and electronics, so please feel free to consult with us.

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High connectivity reliability electroless copper plating process with excellent follow-up characteristics.

High connectivity reliability electroless copper plating process with excellent follow-up characteristics.

Introducing the latest surface treatments for semiconductor package substrates all at once. We propose surface treatments and plating chemicals that support the miniaturization, high density, and high performance of electronic devices!

Electronic devices such as computers and smartphones are evolving daily. Along with this, multilayer printed circuit boards are also required to be miniaturized and made more densely packed. Our company has newly developed an electroless copper plating process that excels in coverage for the subtractive process using copper-clad laminates for printed circuit board manufacturing. Okuno Pharmaceutical Industry offers a wide variety of processing chemicals primarily for the plating process of printed wiring boards, covering all aspects of wet processes. Additionally, we propose the latest products and processes for the manufacturing processes of IC substrates and interposers produced by semi-additive processes, so please feel free to contact us.

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Electroless plating process for insulation circuit boards for power semiconductors.

Electroless plating process for insulation circuit boards for power semiconductors.

The optimal electroless plating process for the base layer when joining power modules using soldering or silver sintering.

In recent years, SiC and GaN devices have garnered attention as next-generation power semiconductors (power modules) capable of high-temperature operation, with these next-generation power modules expected to operate continuously at temperatures above 200°C. Our company has developed a sulfur-free, low-phosphorus electroless nickel plating solution, "ICP Nicoron LPW-LFN," which minimizes nickel diffusion into solder even in high-temperature environments, thereby maintaining joint reliability. Additionally, sintering bonding using silver particle paste is gaining attention as a high-heat-resistant bonding method to replace traditional solder joints. We have newly developed an electroless silver plating solution, "Top Silver ACC / Top Silver AG," which helps suppress corrosion of the base metal and contributes to improved bonding strength.

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Electroless Ni-P replacement Au plating process with excellent solder wettability.

Electroless Ni-P replacement Au plating process with excellent solder wettability.

For printed circuit boards. An alternative to the electroless Ni-P/replacement Au plating process is possible.

The 'Electroless Ni-P/Replacement Au plating process with excellent solder wettability' is a plating process that uses 4Ag, which has similar characteristics to Au, making it an alternative to the electroless Ni-P/Replacement Au plating process. The solder wettability is better immediately after plating compared to the electroless Ni-P/Replacement Au plating. For more details, please contact us or download the catalog.

  • Processing Contract

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Non-dye-based copper sulfate plating process "Plymouth EX Series"

Non-dye-based copper sulfate plating process "Plymouth EX Series"

Compared to the dye-based copper sulfate plating process, the defect rate has been significantly reduced, resulting in substantial cost savings!

The "Plymouth EX Series" is a non-dye copper sulfate plating process developed by the German company Dr. Hesse (DR.HESSE). Compared to the currently mainstream dye-based copper sulfate plating processes, it significantly reduces the defect rate and contributes to substantial cost savings. We offer "Plymouth EX620-DC," which has leveling characteristics comparable to dye-based systems, and "Plymouth EX-201," which has very high resistance to scorching and excessive additives. 【Features】 ■ Reduction in cooling costs: No issues at a liquid temperature condition of -37°C ■ Reduction in production costs: Applicable with minimal air agitation or mechanical agitation ■ Reduction in defect rates: Relief from pits (bores) and edge buildup ■ Dramatic decrease in frequency of activated carbon replacement filtration: Fewer production downtime days per year, increasing operational days *For more details, please refer to the PDF document or feel free to contact us.

  • paint
  • Coating Agent

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Dry plating process "Chrome PVD"

Dry plating process "Chrome PVD"

Achieving both the appearance of metallic design and radio wave permeability/insulation! An environmentally friendly film formation process that does not use hexavalent chromium.

Metal films with radio wave permeability and insulation properties use "indium vapor deposition" technology. However, the high cost due to being a rare metal and the color tone differences compared to wet chrome plating products are challenges. Our company has established a technology for film formation with radio wave permeability and insulation using 'chrome PVD', which is inexpensive and does not require a coloring process. 【Features】 ■ Insulation of over 1 MΩ ■ Color tone equivalent to wet chrome plating ■ Good adhesion (thermal cycle test) ■ Millimeter wave transmission attenuation lower than indium vapor deposition films ■ Environmentally friendly film formation process that does not use hexavalent chromium *For more details, please refer to the PDF document or feel free to contact us.

  • Other surface treatment equipment

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Technological innovation to reduce transmission loss! Copper plating process on glass substrates.

Technological innovation to reduce transmission loss! Copper plating process on glass substrates.

Developed an electroless copper plating process that achieves high adhesion on glass substrates with low dielectric loss!

Glass has high smoothness and insulation properties, making it excellent for signal transmission characteristics, and it is gaining attention as an interposer material necessary for 2.5D implementation in semiconductor packaging. Various methods for forming adhesion layers, such as sputtering and sol-gel methods, have been researched to improve adhesion to glass materials. Our company has developed an electroless copper plating process called "PLOPX," which achieves high plating adhesion to glass substrates by using metal oxides deposited via Liquid Phase Deposition (LPD) as the adhesion layer. This process allows for all steps to be treated using wet methods.

  • Surface treatment contract service

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Electroless copper plating process for glass substrates for TGV surface treatment

Electroless copper plating process for glass substrates for TGV surface treatment

In collaboration with Panasonic Environmental Engineering Co., Ltd., we have newly developed an electroless copper plating process called "PLOPX" that achieves high adhesion on glass substrates!

Glass has high smoothness and insulation properties, making it excellent in signal transmission characteristics and attracting attention as an interposer material necessary for 2.5D implementation in semiconductor packaging. Various adhesion layers have been researched for improving adhesion to glass materials, including sputtering methods and sol-gel methods. Our company has developed an electroless copper plating process called "PLOPX," which achieves high plating adhesion to glass substrates by using metal oxides deposited via Liquid Phase Deposition (LPD) as the adhesion layer. This process allows all steps to be treated using wet methods.

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High connection reliability electroless copper plating process for semiconductor package substrates

High connection reliability electroless copper plating process for semiconductor package substrates

Ensuring crystal continuity at the interface between the inner copper layer and the upper plating layer, achieving advanced reliable connectivity required by cutting-edge packages.

OPC FLET Copper is an electroless copper plating solution of the noncyanide Rochelle salt type, adapted for semi-additive processes. It excels in low film thickness and uniform deposition on material surfaces and within via holes, reducing circuit width narrowing during flash etching. Additionally, it suppresses deposition on copper surfaces, achieving continuity of crystals between inner layer copper and upper layer plated copper, making it an ideal plating solution for fine pattern and micro via hole formation in IC substrates. 【Features】 - Excellent connection reliability between upper layer plated copper and inner layer copper - Achieves low film thickness with uniform and stable deposition on material surfaces and via hole walls - Suppresses blister formation on low roughness materials, providing excellent peel strength - The film demonstrates high purity and low resistance values, not hindering subsequent pattern plating even at low film thickness

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Electroless copper plating process for liquid crystal polymers (LCP)

Electroless copper plating process for liquid crystal polymers (LCP)

Developed a process that combines surface modification and plating to ensure high adhesion for liquid crystal polymers (LCP), known as the top LECS process.

Since 2020, following 4G, 5G mobile communication services have also started in Japan. 5G not only enables ultra-high-speed communication but also features ultra-low latency that allows for smooth operation of robots and other devices in remote locations, as well as the ability to connect multiple smartphones and computers simultaneously. Currently, high-frequency compatible substrates using low-dielectric materials such as LCP and fluorine-based resins are attracting attention as suitable materials for high-speed transmission. In particular, liquid crystal polymer (LCP) excels in electrical properties in the high-frequency range, has a low moisture absorption rate, and offers excellent dimensional stability, leading to its increasing adoption for 5G and millimeter-wave applications. Our company has developed a process that combines surface modification and plating to ensure high adhesion for LCP, which is said to have difficulty securing copper plating adhesion.

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Non-electrolytic copper plating process "OPC SUBLET process"

Non-electrolytic copper plating process "OPC SUBLET process"

Electroless copper plating process "OPC SUBLET process" that achieves high connection reliability.

In recent years, the application environment for printed circuit boards has expanded, particularly in fields related to electric vehicles and autonomous driving, where there is a strong demand for improved reliability of interlayer connections, heat resistance, and durability. Additionally, in response to environmental regulations such as the RoHS directive, there is a consideration to switch the solder used in assembly from low-melting-point Sn-Pb solder (melting point 183°C) to high-melting-point solders such as Sn-Ag (melting point approximately 220°C). Therefore, our company has newly developed an electroless copper plating process that can maintain connection reliability even under severe conditions such as high temperature and high pressure.

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Aluminum electrode on wafer UBM formation plating process

Aluminum electrode on wafer UBM formation plating process

Plating chemicals, total proposals for surface treatment processes and equipment, aluminum electrodes on wafers, UBM formation, plating process.

UBM (Under Barrier Metal) employs processes such as electroless Ni/Au plating and electroless Ni/Pd/Au plating. However, conventional processes have faced challenges such as localized corrosion of aluminum electrodes, poor appearance of plating, and poor adhesion. Additionally, in recent years, as power semiconductors have progressed towards higher voltage and higher current, there has been a demand for further heat resistance in electroless plating films. In response, we have developed a new UBM formation plating process called "TORYZA EL PROCESS," which suppresses film reduction and localized corrosion of aluminum electrodes while providing excellent uniform deposition, smoothness, and adhesion of electroless Ni plating. Along with the electroless plating equipment for UBM formation, "TORYZA EL SYSTEM," we offer a comprehensive proposal for plating chemicals, surface treatment processes, and equipment for semiconductor back-end processes.

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Electroless nickel-boron plating process for metal ink circuits on sintered substrates.

Electroless nickel-boron plating process for metal ink circuits on sintered substrates.

Electroless nickel-boron plating process on metal ink circuits on sintered substrates with excellent bath stability.

Optical communication module components and package components are advancing in fine wiring, and the required pattern quality for electroless nickel plating is becoming increasingly demanding. Our company has newly developed an electroless nickel-boron plating process on metal ink paste for sintered substrates that excels in pattern quality compared to conventional methods.

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Fine pattern compatible high joint reliability electroless nickel/gold plating process

Fine pattern compatible high joint reliability electroless nickel/gold plating process

An electroless nickel/gold plating process with excellent fine patterning, ideal for plating on fine wiring.

As electronic devices become lighter, thinner, smaller, and more functional, there is a demand for finer patterns on semiconductor package substrates that incorporate semiconductor components. Our company has developed a new electroless nickel/gold plating process that supports fine patterns, reducing the occurrence of voids and pinholes while ensuring high connection reliability.

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Electroless plating process for insulated circuit boards for power modules.

Electroless plating process for insulated circuit boards for power modules.

Electroless plating process for insulating circuit boards for power modules with excellent heat resistance.

In recent years, SiC and GaN devices have attracted attention as next-generation power semiconductors capable of high-temperature operation, and next-generation power modules equipped with these devices are expected to operate continuously at temperatures above 200°C. Therefore, coatings that have low nickel diffusion into solder even in high-temperature environments are in demand. Additionally, sintering bonding using silver particle paste is gaining attention as a high-heat-resistant bonding method to replace conventional solder joints, and silver plating is being sought to improve bonding strength. In response, our company has newly developed an electroless plating process for insulating circuit boards for power modules.

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